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- ...o predict grinding down to about 200 µm with no need for a ball mill work index. * [[Testwork: SAG grindability index|SAG grindability index]]4 KB (537 words) - 20:47, 6 March 2022
- ...SMC Test]] and a [[Testwork: Bond ball mill work index|Bond ball mill work index]] test.7 members (0 subcategories, 0 files) - 02:00, 7 March 2020
- ...index]]. The method requires '''all the elements''' of the ball mill work index test to be filled in: ...e fresh feed to the circuit, ie, primary crusher product (expected to be a Bond-compatible size distribution).4 KB (611 words) - 20:48, 6 March 2022
- [[Category: Bond/Barratt Model]] ...odels|Bond/Barratt models]] for SAB and SABC circuits except that the work index values simulated come from a Normal distribution that is defined by synthet2 KB (240 words) - 20:17, 25 May 2023